會(huì)員優(yōu)惠價(jià)代購(gòu)所有IPC正版標(biāo)準(zhǔn)！
培訓(xùn)時(shí)間：每月循環(huán)開班
培訓(xùn)地點(diǎn)：上海浦東張江高科技園區(qū)蔡倫路333號(hào)浦東創(chuàng)新港
培訓(xùn)費(fèi)用：2500元/人/2天
聯(lián)系人：Lucy Tel: / Fax: E-mail:
內(nèi)容簡(jiǎn)介：
? 電子封裝簡(jiǎn)介Brief introduction of electronic package
? 失效定義及分類Definition and classification of failures
? 電子產(chǎn)品為何失效Why do electronic products fail?
? 失效分析的目標(biāo)The objectives of failure analysis
? 失效分析的重要性Understand the importance of failure analysis
? 失效分析的思想方法Philosophical approach of failure analysis
? 失效分析技術(shù)線路Technique approach of failure analysis
? 失效分析流程Failure analysis flow charts
? 元器件典型失效模式和機(jī)理Typical failure modes and failure mechanisms of electronics components
? 產(chǎn)品可靠性浴盆曲線Product reliability and bathtub curve
? 篩選試驗(yàn)，可靠性試驗(yàn)，可靠性認(rèn)證Screening tests, reliability tests, qualification tests
? 常見可靠性試驗(yàn)、目的、誘導(dǎo)的典型失效模式及機(jī)理等Common reliability tests, objectives, typical failure modes and mechanisms
? 典型集成電路塑料封裝器件的封裝認(rèn)證標(biāo)準(zhǔn)簡(jiǎn)介Typical standards on package qualification of plastic packaged ICs
? 器件結(jié)構(gòu)分析Package construction analysis
? 塑料封裝器件中的水汽擴(kuò)散、回流焊接過(guò)程中濕氣蒸發(fā)引起的分層、爆裂等失效現(xiàn)象 Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc.
? 器件濕氣敏感性分級(jí)：JESD020C:非氣密性表面封裝固態(tài)電路的水汽/回流敏感性等級(jí) Moisture sensitivity level: JESD020C: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
? 如何判斷與濕氣敏感性相關(guān)的失效的根本原因：器件質(zhì)量還是電子組裝？How to judge the root cause when popcorn crack happens: device quality or SMT problem?
? 器件懷疑吸濕如何處理：實(shí)用指南 What to do, if your devices are susceptible of excessive moisture absorption: a practical guide
? 焊接界面形成 Solidification and interface intermetallics formation
? 電子產(chǎn)品服役過(guò)程中焊料組織及界面金屬間化合物的演化及其與焊點(diǎn)失效的關(guān)系 Evolution of solder micro-structure and interface intermetallics and effects on solder joint lifetime
? 影響焊點(diǎn)壽命的典型設(shè)計(jì)、工藝、材料等因素 Typical design, material, process parameters affecting soldering joint lifetime
? 焊點(diǎn)失效分析流程 Typical flow chart for solder joint failure analysis
? 焊點(diǎn)失效典型模式及分析方法 Typical failure modes and analy
