目錄
Catalog 培訓(xùn)內(nèi)容/時間
Course Title 課程內(nèi)容
Content
可靠性
Reliability 可靠性、質(zhì)量認證及測試
Reliability, Qualification and test
0.5 天
0.5 day · 微電子器件及微系統(tǒng)簡介Brief introduction of microelectronic devices and micro-electronic systems
· 可靠性描述和浴盆曲線 Reliability description and bathtub curve
· 常見可靠性模型和加速因子估算 Common reliability model and active factor estimation
· 可靠性試驗和認證 Typical reliability tests
· 器件結(jié)構(gòu)分析 Package construction analysis
可靠性
Reliability 塑料封裝器件的潮氣敏感性及相關(guān)問題
Moisture Sensitivity and Relevant Issues
0.5 天
0.5 day · 塑料封裝器件中的水汽擴散、回流焊接過程中濕氣蒸發(fā)引起的分層、爆裂等失效現(xiàn)象 Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc.
· 器件濕氣敏感性分級：JESD020: 非氣密性表面封裝固態(tài)電路的水汽/回流敏感性等級 Moisture sensitivity level: JESD020: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
· 如何判斷與濕氣敏感性相關(guān)的失效的根本原因：器件質(zhì)量還是電子組裝？How to judge the root cause when popcorn crack happens: device quality or SMT problem?
· 器件懷疑吸濕如何處理：實用指南 What to do, if your devices are susceptible of excessive moisture absorption: a practical guide
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